Microcomputer Project Updates
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Accelerometer Testing
27 May 2010 1:59 PM | 2 Comments -
Final Project
12 May 2010 9:48 AM | No Comments -
Project Proposal
07 April 2010 12:27 PM | No Comments -
PWM / Motor Control Update
31 March 2010 9:05 AM | No Comments -
Preliminary Investigation
30 March 2010 12:25 PM | No Comments
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Lab 7 – Stack Pointer & Subroutines
This lab provides an introduction to using the stack and subroutines. Both of these topics are critical for efficient assembly programing. The name ‘stack’ gives a very good description of the function of the stack pointer and its use; when something needs to be stored temporarily and will be used again soon it can be [...] -
Lab 2 – Quantitative Metallography
Quantitative metallography is the study of metallic crystal structures from the perspective of numeric quantities. Examples of quantitative metallographic measurements include number of grains per unit area and fraction of specific phase per unit volume. These two quantities are what we will investigate in this lab. -
Lab 3 – Semiconductors
The purpose of this experiment is to determine the band gap energy (E0) in the elemental solid germanium. In a semiconductor like germanium electrons must be promoted from the valence energy band through the band gap to the conduction band in order for the substance to conduct electricity [1]. Therefore, the band gap can be [...] -
Lab 4 – Cold Work
The purpose of this experiment is to determine the increase in hardness of an annealed (heat treated) copper sheet after it is passed through a rolling mill. The rolling mill reduces the thickness of the copper sheet by exerting compressive stress. This is an example of cold working, as the deformation of the copper sheet [...] -
Lab 6 – Creep
Creep is a condition where a material will undergo progressive plastic deformation under constant load or stress. In most metals, this behavior is only present at elevated temperatures, but a few soft metals like tin and lead will experience creep at room temperatures. This experiment will explore the creep behavior of lead. -
Lab 6 – Intro to HC11 EVB
This experiment serves as an introduction to the EVB. While there are many methods for communicating with the EVB we will use the THRSim11 to assemble and download our programs to the board. Since we are already familiar with the simulator the transition to the actual board is elementary. The simulator software simply requires that [...] -
Lab 5 – Tensile Testing
Tensile testing is an important aspect of material science. Many of a materials mechanical properties can be ascertained through tensile testing. In this lab we will use data from a tensile test of a sample taken to fracture. From this data we will be able to find the materials Modulus of Elasticity (E), Poisson’s ratio, [...] -
Lab 4 – Intro to THRSim11
The main purpose of this lab is to introduce the THRSim11 simulator. The THRSim11 essentially aims to duplicate the entire functionality of the HC11 micro-controller with only a very few features excluded (specific exceptions available at http://www.hc11.demon.nl/thrsim11/nearly.htm). This tool simplifies the design and testing of assembly code for the HC11 by allowing the designer to [...] -
Lab 3 – Conditional Branching
One of the most powerful aspects of a computer is its ability to perform conditional logic operations. This logic is what allows computers to react to changes in input with the correct change in output. Without being able to use this ‘If, then’ type logic the computer could only be able to solve static problems, [...] -
Lab 2: Two’s Compliment
This lab introduces the programer to many important programing concepts including: Signed numbers Two’s compliment conversion Subtraction by 2’s compliment addition Multiplication and division by binary shift Condition code registers Indexed addressing mode Conditional looping These techniques will be used to solve simple problems and evaluated using the excel simulator.